Embedded Solution

Development of embedded industrial products suitable for customers


Com-Express image processing platform with built-in interface for various industrial camera

  • Equipped with COM-Express (Type 2) compatible CPU (Intel Core i7 / i5)
  • GPIO can be used according to Mini-ITX standard board size
  • PoCL(Base) SDR Connector x 2pcs installed 2 SDR connector x2 installed
  • Fiber optical connector (Opt-C: Link) × 2 ch installed
  • GPIO connector for image input control × 1 ch installed
  • Photo isolation DIO (In/Out : 16/16) connector x 1ch (MDR-36)
  • 1000 BASE-T compatible LAN × 2 ch, USB × 4 ch, Analog VGA × 1 ch installed
  • One PCI Express x16 expansion slot installed
Main function Specification
Major functional device CPU Module Intel Core i7 / i5 / Celeron Processor (choose one)
Using COM ExpressType 2 module
LAN LAN 0: 82574 (Intel)
LAN 1: Use LAN with COM Express
FPGA Arria II GX (Camera Link, optical communication) Changeable with migration, Cyclone II (Photo Isolation DIO)
Memory 4 GB (Implemented in CPU Module)
Front interface Power over Cameralink Power over Camera Link
SDR 26pin × 2ch
BASE Configuration Only × 2ch
BASE or MEDIUM / FULL Configuration × 1ch
Opt-C:Link × 2 ch (distribution or Opt-C: Link I / F camera connection)
LAN RJ45 1000BASE-T / 100BASE-TX / 10BASE-T × 2ch
USB Type A × 4ch
Photo Isolation
Digital I / O
MDR36pin × 1ch
Analog VGA HD D-Sub 15pin (Socket) × 1ch
GP Digital I / O HD D-Sub 15pin (Pin) × 1ch
Onboard COM Express Type-2 × 1ch
PCI Express × 1ch (Mechanical × 16 Electrical × 8)
SATA × 2ch (SATA II 3Gbps)
USB Type A × 1ch
Power ON Switch 2pin × 1ch
COM × 2ch
GP Digital I / O × 1ch (BOX HEADER26pin)
FAN × 2ch
POWER IN ATX 20pin × 1ch, DC12V (4pin) × 1ch
Substrate size 170 mm × 170 mm (excluding projections)
Supported OS Windows
Environmental response Lead-free solder, RoHS compliant parts used
– The specifications and appearance stated are subject to change without notice.
– Power consumption does not include inrush current.
– In order to use the product correctly, be sure to read the instruction manual before using the product. Also, use the product under the conditions applicable to your product warranty.
Model name ASB-1302-S ASB-1302opt-S ASB-1323-S ASB-1323opt-S ASB-1362-S
CameraLink 2ch (Base) 2ch (Base) 1ch
(Base / Medium / Full)
(Base / Medium / Full)
Opt-C : Link × × × × 2ch
Optical I / F distribution function × × ×
CPU Default : Intel Core i5 (Ask us other CPU such as i3, i7, Celeron)
Software development kit (Note) SDK-ACAP PLUS or
(Note) AZP – ACAP PLUS is a standard software development kit for the ASB – 1300 series. AZP – ACAP – 02 is a software development kit when only using the CameraLink function.
Image distribution function of optical I / F

The optical I / F (Opt-C: Link) mounted on the ASB-1300 can also be applied to image distribution using multiple ASB-1300.
Connect the fiber optic cable with the configuration shown in the figure.

ASI-1300 series: PC for image processing

We also have a compact image processing PC “ASI – 1300” including the special case for the ASB-1300 Series.